BCR189...
PNP Silicon Digital Transistor
• Switching circuit, inverter, interface circuit,
driver circuit
• Built in bias resistor (R1 = 22 kΩ)
BCR189F/L3
BCR189T
C
3
R1
1
B
2
E
EHA07180
Type
Marking
Pin Configuration
Package
BCR189F
W2s
1=B
2=E
3=C
-
-
-
TSLP-3
BCR189L3
W2
1=B
2=E
3=C
-
-
-
TSLP-3-4
BCR189T
W2s
1=B
2=E
3=C
-
-
-
SC75
Maximum Ratings
Parameter
Symbol
Collector-emitter voltage
VCEO
50
Collector-base voltage
VCBO
50
Emitter-base voltage
VEBO
5
Input on voltage
Vi(on)
30
Collector current
IC
100
Total power dissipation
Ptot
Value
250
BCR189L3, TS ≤ 135°C
250
BCR189T, TS ≤ 109°C
250
Tj
Storage temperature
Tstg
1
V
mA
mW
BCR189F, TS ≤ 128°C
Junction temperature
Unit
150
°C
-65 ... 150
Mar-03-2005
BCR189...
Thermal Resistance
Parameter
Junction - soldering point1)
Symbol
RthJS
Value
BCR189F
≤ 90
BCR189L3
≤ 60
BCR189T
≤ 165
Unit
K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Unit
Parameter
min.
typ. max.
DC Characteristics
Collector-emitter breakdown voltage
V(BR)CEO 50
V
IC = 100 µA, IB = 0
Collector-base breakdown voltage
V(BR)CBO
50
-
-
V(BR)EBO
5
-
-
I CBO
-
-
100
nA
h FE
120
-
630
-
-
-
0.3
V
Vi(off)
0.4
-
0.8
Vi(on)
0.5
-
1.1
R1
15
22
29
fT
-
200
-
MHz
Ccb
-
3
-
pF
IC = 10 µA, IE = 0
Emitter-base breakdown voltage
IE = 10 µA, IC = 0
Collector-base cutoff current
VCB = 40 V, IE = 0
DC current gain2)
IC = 5 mA, VCE = 5 V
Collector-emitter saturation voltage2)
VCEsat
IC = 10 mA, IB = 0.5 mA
Input off voltage
IC = 100 µA, VCE = 5 V
Input on voltage
IC = 2 mA, VCE = 0.3 V
Input resistor
kΩ
AC Characteristics
Transition frequency
IC = 10 mA, VCE = 5 V, f = 100 MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz
1For calculation of R
thJA please refer to Application Note Thermal Resistance
2Pulse test: t < 300µs; D < 2%
2
Mar-03-2005
BCR189...
DC current gain hFE = ƒ(IC)
VCE = 5 V (common emitter configuration)
Collector-emitter saturation voltage
VCEsat = ƒ(IC), hFE = 20
10 3
10 -1
A
IC
h FE
10 -2
10 2
10 -3
10 1 -4
10
10
-3
10
-2
A
10
10 -4
0
-1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
IC
V
1
VCEsat
Input on Voltage Vi(on) = ƒ(I C)
VCE = 0.3V (common emitter configuration)
Input off voltage V i(off) = ƒ(IC)
VCE = 5V (common emitter configuration)
10 -2
10 -1
A
A
10 -3
IC
IC
10 -2
10 -4
10 -3
10 -5
10 -4 -1
10
10
0
10
1
V
10
10 -6
0
2
Vi(on)
0.5
1
1.5
2
V
3
Vi(off)
3
Mar-03-2005
BCR189...
Total power dissipation Ptot = ƒ(TS)
BCR189F
Total power dissipation Ptot = ƒ(TS)
BCR189L3
300
300
mW
200
P tot
P tot
mW
200
150
150
100
100
50
50
0
0
20
40
60
80
100
120 °C
0
0
150
TS
20
40
60
80
100
120 °C
150
TS
Total power dissipation Ptot = ƒ(TS)
BCR189T
300
Ptot
mW
200
150
100
50
0
0
20
40
60
80
100
120 °C
150
TS
4
Mar-03-2005
BCR189...
Permissible Puls Load RthJS = ƒ (tp)
Permissible Pulse Load
BCR189F
Ptotmax/P totDC = ƒ(tp)
BCR189F
10 2
10 3
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10 1
10 0
10 -1 -6
10
P totmax/P totDC
RthJS
K/W
10
-5
10
-4
10
-3
10 2
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 1
10
-2
s
10
10 0 -6
10
0
10
-5
10
-4
10
-3
10
-2
s
tp
Permissible Pulse Load
BCR189L3
Ptotmax/P totDC = ƒ(tp)
BCR189L3
10
0
10 3
Ptotmax/ PtotDC
RthJS
10 2
1
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D=0
10 0
10 -1 -7
10
0
tp
Permissible Puls Load RthJS = ƒ (tp)
10
10
10
-6
10
-5
10
-4
10
-3
10
-2
10
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2
10 1
s
10
10 0 -7
10
0
tp
10
-6
10
-5
10
-4
10
-3
10
-2
s
tp
5
Mar-03-2005
BCR189...
Permissible Puls Load RthJS = ƒ (tp)
Permissible Pulse Load
BCR189T
Ptotmax/P totDC = ƒ(tp)
BCR189T
10 3
10 3
P totmax / P totDC
K/W
RthJS
10 2
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 2
10 1
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10 0
10 -1 -6
10
10
-5
10
-4
10
-3
10 1
10
-2
s
10
10 0 -6
10
0
tp
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
6
Mar-03-2005
Package SC75
Package Outline
1.6 ±0.2
0.2 +0.1
-0.05
1
0.2 +0.1
-0.05
1.6 ±0.2
+0.2
acc. to
DIN 6784
3
2
10˚ MAX.
0.8 ±0.1
0.1 MAX. 0.7 ±0.1
10˚ MAX.
A
0.15 ±0.1
0.5
0.10
0.5
0.20
M
M
A
Foot Print
0.65
1.15
0.65
0.4
0.4
0.5 0.5
Marking Layout
Manufacturer
Pin 1
Type code
BCR108T
Example
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
4
0.2 MAX.
1.8
8
1.4
0.45
Pin 1
1.75
0.9
Package TSFP-3
Package Outline
1.2 ±0.05
1.2 ±0.05
2
0.1 MIN.
3
1
A
10˚ MAX.
0.8 ±0.05
0.55 -0.05
0.2 ±0.05
0.15 ±0.05
0.2 ±0.05
0.4 0.4
0.1
M
0.1
M
A
3x
Foot Print
0.9
0.45
0.45
0.4
0.4
0.4
Marking Layout
Manufacturer
Pin 1
Type code
BCR847BF
Example
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
1.5
8
1.2
0.3
Pin 1
1.35
0.7
Package TSLP-3-4
Package Outline
Top view
Bottom view
0.4 ±0.05
0.6
S
0.05 MAX.
0.5 ±0.035
0.03 S
2x
A
1)
0.1 M A B
0.05
0.05 2x
2
1
0.35
Orientation
marking
2x
0.15 ±0.035 1)
0.1 M A B
1) Dimension applies to plated terminals
0.5
R0.1
0.2
0.225
0.2
0.225
0.17
0.15
Copper
Solder mask
Stencil apertures
Marking Layout
Type code
Laser marking
Packing
Code E6327: Reel ø180 mm = 15.000 Pieces/Reel
0.5
Orientation
marking
0.76
8
1.16
4
0.315
0.35
1
0.95
0.2
0.45
R0.19
0.38
0.6
0.255
Foot Print
0.4 ±0.035 1)
2
0.25 ±0.035 1)
1
1
0.575
3
3
B
0.1 M A B
0.1 M A B 2x
Impressum
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München
© Infineon Technologies AG 2005.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body, or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
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